4 Yamaha lines
2 Juki lines
2 Juki lines
SMT Line
Package on Packing
700mm x 460mm
Max PCB size
Acqueous Cleaning
Min ball pitch 0.4mm,
Ball dimension 0.15mm,
Ball dimension 0.15mm,
BGA, Micro-BGA , CSP, Flip Chip
Min 0.05mm
Fine pitch IC
Positioning accuracy: ±0.02mm,
Pick and place DIE speed: <0.32s,
X/Y axis accuracy: ±0.038mm,
Total Capacity up to 1.36 million dies per month,
Pick and place DIE speed: <0.32s,
X/Y axis accuracy: ±0.038mm,
Total Capacity up to 1.36 million dies per month,
Precision Die Bonder AB530
AB530:
Speed : 130ms,
Repeatability : +/- 0.5mil,
Pad Size: 63um, Pad Pitch : 68um,
Wire Diameter : 0.8 – 1.5mil,
Capacity:
AB520 – 17 sets,
AB530 – 9 sets, AB559 – 1 set,
Total Capacity up to 1.6 million,
wires per month ( 11 Hrs per shift ),
Speed : 130ms,
Repeatability : +/- 0.5mil,
Pad Size: 63um, Pad Pitch : 68um,
Wire Diameter : 0.8 – 1.5mil,
Capacity:
AB520 – 17 sets,
AB530 – 9 sets, AB559 – 1 set,
Total Capacity up to 1.6 million,
wires per month ( 11 Hrs per shift ),
Wire Bonding
Wave Soldering , Selective Soldering,
Existing reflow oven ( FLW-VP1060)
can extend N2 function if necessary,
Existing reflow oven ( FLW-VP1060)
can extend N2 function if necessary,
Nitrogen Protection
Auto Epoxy Coating Machine,
Epoxy accuracy: ±0.05mm,
X/Y axis accuracy: ±0.02mm,
Positioning speed: <1s,
Epoxy accuracy: ±0.05mm,
X/Y axis accuracy: ±0.02mm,
Positioning speed: <1s,
Coating
4.8 Million Chips per month
Surface Mount Capacity
Fully automatic
laser eraser for PCB
laser eraser for PCB
Laser Trimming
Class 10,000 clean room
for Assembly. Clean room
facility for die-attach
and die bonding.
for Assembly. Clean room
facility for die-attach
and die bonding.
Clean Rooms
6*6 mil – 50*50mil
Die Size
Min ball pitch 0.4mm,
Ball dimension 0.15mm,
Ball dimension 0.15mm,
BGA, Micro-BGA , CSP, Flip Chip
AOI , 2D X-Ray, Off line
solder paste thickness
inspection machine,
solder paste thickness
inspection machine,
Inspection machine
PCB routing depanelizing machine
PCB width ： 50 -350 mm,
3 preheating zone and dual solder wave,
Up to temperature: 300 ℃,
Applicable with N2 process,
component height : Top 120mm ; Bottom 15 mm,
3 preheating zone and dual solder wave,
Up to temperature: 300 ℃,
Applicable with N2 process,
component height : Top 120mm ; Bottom 15 mm,
Wave soldering
Max solder wave height : 5mm,
Max solder temperature : 320 ℃,
Position accuracy : +/- 0.15mm,
Dual solder pot for highest flexible, wave height
monitored available. PCB size : 510 mm * 450 mm,
Max solder temperature : 320 ℃,
Position accuracy : +/- 0.15mm,
Dual solder pot for highest flexible, wave height
monitored available. PCB size : 510 mm * 450 mm,
Selective soldering
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