![](https://ewig-mco.com/wp-content/uploads/2018/10/SMT-Line.jpg)
4 Yamaha lines
2 Juki lines
2 Juki lines
SMT Line
![](https://ewig-mco.com/wp-content/uploads/2018/09/bb2.png)
Package on Packing
![](https://ewig-mco.com/wp-content/uploads/2018/09/e.png)
700mm x 460mm
Max PCB size
![](https://ewig-mco.com/wp-content/uploads/2018/09/b.png)
Acqueous Cleaning
![](https://ewig-mco.com/wp-content/uploads/2018/09/c.png)
Min ball pitch 0.4mm,
Ball dimension 0.15mm,
Ball dimension 0.15mm,
BGA, Micro-BGA , CSP, Flip Chip
![](https://ewig-mco.com/wp-content/uploads/2018/09/g.png)
Min 0.05mm
Fine pitch IC
![](https://ewig-mco.com/wp-content/uploads/2018/09/Precision-Die-Bonder-.jpg)
Positioning accuracy: ±0.02mm,
Pick and place DIE speed: <0.32s,
X/Y axis accuracy: ±0.038mm,
Total Capacity up to 1.36 million dies per month,
Pick and place DIE speed: <0.32s,
X/Y axis accuracy: ±0.038mm,
Total Capacity up to 1.36 million dies per month,
Precision Die Bonder AB530
![](https://ewig-mco.com/wp-content/uploads/2018/09/wire-bonding.jpg)
AB530:
Speed : 130ms,
Repeatability : +/- 0.5mil,
Pad Size: 63um, Pad Pitch : 68um,
Wire Diameter : 0.8 – 1.5mil,
Capacity:
AB520 – 17 sets,
AB530 – 9 sets, AB559 – 1 set,
Total Capacity up to 1.6 million,
wires per month ( 11 Hrs per shift ),
Speed : 130ms,
Repeatability : +/- 0.5mil,
Pad Size: 63um, Pad Pitch : 68um,
Wire Diameter : 0.8 – 1.5mil,
Capacity:
AB520 – 17 sets,
AB530 – 9 sets, AB559 – 1 set,
Total Capacity up to 1.6 million,
wires per month ( 11 Hrs per shift ),
Wire Bonding
![](https://ewig-mco.com/wp-content/uploads/2018/09/nn-1.png)
Wave Soldering , Selective Soldering,
Existing reflow oven ( FLW-VP1060)
can extend N2 function if necessary,
Existing reflow oven ( FLW-VP1060)
can extend N2 function if necessary,
Nitrogen Protection
![](https://ewig-mco.com/wp-content/uploads/2018/09/ff-1.png)
Auto Epoxy Coating Machine,
Epoxy accuracy: ±0.05mm,
X/Y axis accuracy: ±0.02mm,
Positioning speed: <1s,
Epoxy accuracy: ±0.05mm,
X/Y axis accuracy: ±0.02mm,
Positioning speed: <1s,
Coating
![](https://ewig-mco.com/wp-content/uploads/2018/09/ee-1.png)
4.8 Million Chips per month
Surface Mount Capacity
![](https://ewig-mco.com/wp-content/uploads/2018/09/gg-1.png)
Fully automatic
laser eraser for PCB
laser eraser for PCB
Laser Trimming
![](https://ewig-mco.com/wp-content/uploads/2018/09/mm-1.png)
Class 10,000 clean room
for Assembly. Clean room
facility for die-attach
and die bonding.
for Assembly. Clean room
facility for die-attach
and die bonding.
Clean Rooms
![](https://ewig-mco.com/wp-content/uploads/2018/09/jj-1.png)
6*6 mil – 50*50mil
Die Size
![](https://ewig-mco.com/wp-content/uploads/2018/09/kk-1.png)
Min ball pitch 0.4mm,
Ball dimension 0.15mm,
Ball dimension 0.15mm,
BGA, Micro-BGA , CSP, Flip Chip
![](https://ewig-mco.com/wp-content/uploads/2018/09/ll-1.png)
AOI , 2D X-Ray, Off line
solder paste thickness
inspection machine,
solder paste thickness
inspection machine,
Inspection machine
![](https://ewig-mco.com/wp-content/uploads/2018/09/hh-1.png)
PCB routing depanelizing machine
![](https://ewig-mco.com/wp-content/uploads/2018/09/wave-soldering.jpg)
PCB width : 50 -350 mm,
3 preheating zone and dual solder wave,
Up to temperature: 300 ℃,
Applicable with N2 process,
component height : Top 120mm ; Bottom 15 mm,
3 preheating zone and dual solder wave,
Up to temperature: 300 ℃,
Applicable with N2 process,
component height : Top 120mm ; Bottom 15 mm,
Wave soldering
![](https://ewig-mco.com/wp-content/uploads/2018/09/selective.jpg)
Max solder wave height : 5mm,
Max solder temperature : 320 ℃,
Position accuracy : +/- 0.15mm,
Dual solder pot for highest flexible, wave height
monitored available. PCB size : 510 mm * 450 mm,
Max solder temperature : 320 ℃,
Position accuracy : +/- 0.15mm,
Dual solder pot for highest flexible, wave height
monitored available. PCB size : 510 mm * 450 mm,
Selective soldering
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